For use with a disposable carrier for multiplying the wafer throughput:
AIT patent-pending temporary bonding adhesives on disposable carrier:
GD-PRCL-350-WS uses a disposable carrier that is closely matched to that of the device wafer such as silicon.
GD-PRCL-350-SS uses a disposable carrier that is not as closely matched to that of the device wafer.
GD-PRCL-350-FG uses a proprietary high temperature carrier
Melt-Conformable and Bump Encapsulating Wafer Processing Temporary Bonding Adhesive:
Temporary bonding adhesive must melt and conform to absorb and encapsulate all of the bumps and features of the device wafer without stress. These criteria are critical for the success of backgrinding; if the adhesive does not meet these requirements the bumps will be reflected on the backside.
AIT temporary bonding adhesive films WPA-PRCL-350 and GD-PRCL-350-WS:
pre-deposited onto disposable carrier
Molecularly engineered for high flexibility: eliminates need for CTE matched carrier
High melt-flow indices at 140-160ºC
Conform to the highest of bumps, up to 200µm.
AIT disposable carrier solutions offer powerful advantages:
Much higher wafer throughput
Eliminate cost, time, and resources for carrier bonding, debonding, and cleaning
Optimized gain and simplification in 3D wafer processing
Multiplies typical throughput of 20 wafers/hour
AIT’s patent pending melt-conformable temporary bonding adhesive on disposable carrier is molecular designed to have extreme flexibility. It allows conformity without inducing interfacial stress, even without CTE matched carrier wafer.
Film format availability for wafer processing temporary bonding adhesives eliminate dispensing, drying, and post leveling machining processes. Residue-free release from both the device wafer and carrier avoids cleaning processes and saves time, especially compared to focused laser ablation methods. The use of disposable carrier provides even greater efficiency.