Glob-Top Materials for Chip-On-Board Component Protection

Chip-on-board in some applications represents the most cost effective way to incorporate low profile applications.

GLOB-TOP ENCAPSULANTS WITH PROVEN RECORDS OF LONG-TERM RELIABILITY

除了介绍了20多年来广泛应用于空腔封装保护的B级可固化浆料和预成型封盖粘合剂外,AI Technology还详细介绍了近年来被证实可用于先进微电子领域的高温和散热性能的新一代球状封装化合物。 这些AIT的创新产品包括

  • AI Technology球顶封装剂具有175-240℃的超高Tg,适合无铅焊接加工。

With the use of lead-free soldering, high temperature is exposed for components that have to pass through the soldering process along with other components on the same board. Besides having high moisture resistance and low moisture absorption to avoid “pop-corn” effect, higher Tg helps to minimize the tensile stress regime and thus more yield and end with more reliability.

  • 所有的AI Technology球顶封装剂除了机械保护和防潮之外,还提供额外的散热能力。

On the component level, glob-top encapsulation acts more like liquid molding compound with the provision of glob-top dam that can be build-in or using encapsulation dam materials.

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WITH SECOND GENERATION OF MODIFIED EPOXY COMPOUNDS

传统的底层填充和球顶材料与酸酐环氧树脂的Tg约为100-150°C,在250°C回流焊接时,可能会产生过高的界面拉伸应力。新一代的AIT底层填充材料和球顶化合物具有不同的化学成分,可以在240℃的超高Tg下实现新的性能。°AI科技的封装产品采用了高热传导率和低热界面电阻,可为倒装芯片封装的顶部和底部的热量传递提供动力。请点击这里查看视频,了解AI科技的底层填充和球顶封装产品如何助力倒装芯片和板载芯片实现更高性能的详细信息。

Properties of Lid-Seal Adhesives and Glob-Top Encapsulants

PROPERTYMC7865-GT

(Glob-Top Encapsulant)

MC7685-GTS

(Glob-Top Encapsulant)

LESP7670-HF

(ESP7670-HF)

(Lid-Sealing)

LRTK7660-HF

(RTK7660-HF)

(Lid-Sealing)

Electrical Resistivity>2X1014 Ω-cm>2X1014 Ω-cm>5X1014 Ω-cm>2X1015 Ω-cm
Viscosity @5.0 rpm  /Thixotropic Index60,000 cps/2.560,000 cps/2.565,000 cps/4.065,000 cps/4.0
Material Form FactorsSyringe and Frozen StorageSyringe and Frozen StorageB-Stageable at 50-70°C to dry preformB-Stageable at 50-70°C to tacky preform
Customizable ParametersViscosity and Thixotropic IndexViscosity and Thixotropic IndexConductive and/or Thermally ConductiveConductive and/or Thermally Conductive
玻璃转化温度Tg (°C) 240175130165
Device Push-off Strength (psi)>3500>4000>3000>4000
Hardness (Type)~ 90D~ 90D~ 90D~ 85D
Cured Density of Conductive Adhesive Portion (gm/cc)2.52.51.61.6
Thermal Conductivity> 2.0 W/m-°K> 1.8 W/m-°K> 0.20 W/m-°K> 0.20 W/m-°K
Thermal Expansion Coefficient  (ppm/°C)18 (X-Y=Z,  Isotropic)19 (X-Y=Z,  Isotropic)35 (X-Y=Z,  Isotropic)35 (X-Y=Z,  Isotropic)
Maximum Continuous Operation Temperature (°C)> 250> 200150150
Decomposition Temperature @5% weight loss (°C)>450>450>450>450
Recommended Curing Temperature/Time (°C/min.)>125/60>125/120>150/30>150/30

With the additional dimension of adding high thermal conductivity and low interfacial thermal resistance in the underfill and glob-top compounds, thermal dissipation of components generating heat can be assisted with thermal slug and in case of underfill material for the flip-chip components, heat can be dissipated via the provision at the front side of the flip-chip in additional to the traditional backside of the chip.

欲了解更多信息和推荐帮助,请联系AI Technology销售和工程部。

AI Technology技术销售和服务部门也可以通过以下方式联系:1-609-799-9388或1-800-735-5040 (美国东部时间)和传真:609-799-9308。1-609-799-9388或1-800-735-5040(美国东部时间)和传真:609-799-9308