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  • AIT pioneered phase-change adhesives and thermal pads since early 1990’s and patented phase-change thermal interface pads with high compressibility to accommodate and use for power devices with large area power devices with uneven surface roughness and warpage. 
  • Choice of phase-change temperatures from 50°C to 125°C for different operating conditions.
  • Choices of thermal and/or electrical conductivity from diamond, silver, aluminum nitride, boron nitride, alumina, and engineered blends of thermal ingredients.
  • Production choices of standard dry pads to one-side tacky or both side tacky from 20 micron to 2,000 micron thickness.

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  • AIT distinguishes itself for pioneering flexible thermal and/or electrically conductive adhesives in film and paste for microelectronic applications since early 1980’s. 
  • Choices of thermal and/or electrical conductivity from diamond, silver, aluminum nitride, boron nitride, alumina, and engineered blends of thermal ingredients.
  • Production choices of standard dry film adhesives to one-side tacky or both side tacky.
  • Snap-curing options for all paste and film-tape adhesives.

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  • AIT is strong advocates of non-silicone based thermal interface greases to avoid both drying-migration problem inherent in silicone greases.
  • Setting industry standard for high-vacuum and DRIE-process-compatibility thermal greases.
  • Choice of greases for device temperature from 125°C to 250°C. 
  • Choices of thermal and/or electrical conductivity from diamond, silver, aluminum nitride, boron nitride, alumina, and engineered blends of thermal ingredients.
  • Choices of specialty greases that cured in-situ or with applied heat to adhesive-gels.

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