AIT’s compressible thermal interface pads have been carefully engineered to provide the combination of automatic assembly and placement between modules and EV structural-cooling plate system, high-temperature long-term reliability, and end-of-life recycling ease as an integral part of the solution. Additional features include:
- Low thermal resistance between cells to casing while providing UL V-0 fire-retardant as an integral part of the thermal conductivity engineering.
- Proven more than 30 years in thermal management reliability, non-curing molecular flexibility is specifically engineered in the thermal interface padding to provide shock and stress absorption between module and the battery frame structure and cooling plate system.
- Instead of high-strength thermal adhesives that are hard to recycle at the end of life, the non-bonding pads are easy to remove to recover the metals and other elements in the battery cells.